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  september 2009 doc id 16288 rev 1 1/7 7 stpsc1206 600 v power schottky silicon carbide diode features no reverse recovery switching behavior independent of temperature dedicated to pfc boost diode description these diodes are manufa ctured using silicon carbide substrate. this wide bandgap material supports the manufacture of a schottky diode structure with a high voltage rating. such diodes exhibit no or negligible recovery characteristics. the recovery characteristics are independent of the temperature. using these diodes will significantly reduce the switching power losses of the associated mos- fet, and thus increase the efficiency of the overall application. these diodes will then outperform the power factor correction circuit operating in hard switching conditions. table 1. device summary i f(av) 12 a v rrm 600 v t j (max) 175 c q c (typ) 12 nc k a to-220ac STPSC1206D www.st.com
characteristics stpsc1206 2/7 doc id 16288 rev 1 1 characteristics to evaluate the conduction losses use the following equation: p = 1.2 x i f(av) + 0.075 x i f 2 (rms) table 2. absolute ratings (limiting values at 25 c unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 600 v i f(rms) forward rms current 30 a i f(av) average forward current t c = 110 c, = 0.5 12 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal, t c = 25 c t p = 10 ms sinusoidal, t c = 125 c t p = 10 s square, t c = 25 c 50 40 200 a i frm repetitive peak forward current t c = 105 c, t j = 150 c, = 0.1 50 a t stg storage temperature range -55 to +175 c t j operating junction temperature -40 to +175 c table 3. thermal resistance symbol parameter maximum value unit r th(j-c) junction to case 1.75 c/w table 4. static electrical characteristics symbol parameter tests conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm - 30 150 a t j = 150 c - 200 1500 v f (2) forward voltage drop t j = 25 c i f = 12 a -1.41.7 v t j = 150 c - 1.6 2.1 1. t p = 10 ms, < 2% 2. t p = 500 s, < 2% table 5. other parameters symbol parameter test conditions typ. unit q c total capacitive charge v r = 400 v, i f = 12 a di f /dt = -200 a/s, t j = 150 c 12 nc c total capacitance v r = 0 v, t c = 25 c, f = 1 mhz 750 pf v r = 400 v, t c = 25 c, f = 1 mhz 65
stpsc1206 characteristics doc id 16288 rev 1 3/7 figure 1. forward voltage drop versus forward current (typical values) figure 2. reverse leakage current versus reverse voltage applied (maximum values) i fm (a) 0 2 4 6 8 10 12 14 16 18 20 22 24 0.0 0.5 1.0 1.5 2.0 2.5 3.0 t j =150 c t j =150 c t j =175 c t j =175 c t j =25 c t j =25 c v fm (v) i r (a) 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 0 50 100 150 200 250 300 350 400 450 500 550 600 t j =25 c t j =25 c t j =150 c t j =150 c t j =175 c t j =175 c v r (v) figure 3. peak forward current versus case temperature figure 4. junction capacitance versus reverse voltage applied (typical values) i m (a) 0 10 20 30 40 50 60 70 80 90 100 110 0 25 50 75 100 125 150 175 t =tp/t tp =0.1 =0.3 =0.5 d=1 =1 d=0.7 =0.7 t c (c) c(pf) 0 100 200 300 400 500 600 1 10 100 1000 f=1 mhz v osc =30 mv rms t j =25 c v r (v)
characteristics stpsc1206 4/7 doc id 16288 rev 1 figure 7. total capacitive charges versus di f /dt (typical values) figure 5. relative variation of thermal impedance junction to case versus pulse duration figure 6. non-repetitive peak surge forward current versus pulse duration (sinusoidal waveform) z th(j-c) /r th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 single pulse t p (s) i fsm (a) 1.e+01 1.e+02 1.e+03 1.e - 05 1.e - 04 1.e - 03 1.e - 02 1.e - 01 1.e+00 t c =25 c t c =125 c t p (s) q c (nc) 0 2 4 6 8 10 12 14 16 18 20 22 0 50 100 150 200 250 300 350 400 450 500 i f =12 a v r =400 v tj=150 c di f /dt(a/s)
stpsc1206 package information doc id 16288 rev 1 5/7 2 package information epoxy meets ul94, v0 colling method: convection (c) recommended torque: 0.4 to 0.6 nm in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 6. to-220ac dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 h2 10.00 10.40 0.393 0.409 l2 16.40 typ. 0.645 typ. l4 13.00 14.00 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. i 3.75 3.85 0.147 0.151 a c d l7 ? i l5 l6 l9 l4 f h2 g l2 f1 e m
ordering information stpsc1206 6/7 doc id 16288 rev 1 3 ordering information 4 revision history table 7. ordering information order code marking package weight base qty delivery mode STPSC1206D STPSC1206D to-220ac 1.86 g 50 tube table 8. document revision history date revision changes 28-sep-2009 1 first issue.
stpsc1206 doc id 16288 rev 1 7/7 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2009 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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